Diamond Superabrasives
Saw Grit Diamond
FRD series Saw Grit Diamond is widely used for making diamond saw blade, diamond segment, diamond wire saw, diamond drill bit, which are mostly used for cutting and drilling stones(marble, granite, quartz, Dekton), glass, ceramic, asphalt and concrete of construction, civil engineering and mining industry.
Type: FRD100,FRD150,FRD200,FRD300,FRD400,FRD500,FRD600,RD700, FRD800, FRD900, FRD900+
Size: 10/12 ~ 70/80
Metal Bond Mesh Diamond
FRD series MBD wheel mesh diamond is designed for making Metal bond, Electroplated and Single layer vacuum brazing diamond grinding wheel and polishing pad, which are mainly used for glass, ceramic, semi-conductor industry.
Type: FRD100,FRD200,FRD300,FRD500,FRD600,RD700, FRD800, FRD900
Size: 80/100 ~ 325/400
Crushed/Milled Mesh Diamond
Crushed and milled by Green and Yellow crystal raw diamonds.
Recommended for resin bond, vitrified bond, metal bond and electroplated bond diamond grinding and polishing tools.
Type: FRD-G, FRD-Y, FRD-M
Size: 50/60 ~ 325/400
Resin Bond Mesh Diamond
Multicrystalline and friable/rough surface particle shape, good self-sharpening ability.
Mainly in Resin bond and Vitrified bond systems for ceramics, tungsten carbide machining.
Type: FRD-R, FRD-R2
Size: 50/60 ~ 325/400
Micron Diamond
Metal bond micron diamond
Resin bond micron diamond
Agglomerated Diamond
Polycrystalline Like Diamond
Polycrystalline diamond by Detonation
Nano Diamond
Type: FRM-G, FRM-R, FRM-Y, FRM-H, FRM-PCD, FRM-DW, FRM-AG, FRM-PLM, FRM-PD, FRM-ND, FRM-A
Size: 3-10nm ~ 50-60μm
Coated Diamonds
Metallic coatings can enhance the retention between diamond and bond system, therefore improve the tool life.
Improve heat dissipation and reduce heat damage thus protect the diamonds during high-temperature sintering.
Type: Ti, Ni, Co, W(Tungsten), Si, Cr, Ti+Ni, Si+Ni, Ti+W, other types can be customized.
Size: Mesh & Micron
Boron Doped Diamond (BBD)
A diamond with Boron doped which has a better heat resistance (sintering temperature can be around 1100℃ while normal diamond is only around 750 ~ 800℃).
Irregular shape, good self-sharpness.
Mainly for Resin bond and Vitrified bond system.
Size: 50/60 ~ 400/500
Cubic Diamond
Cubic crystal shape with sharp cutting edge.
Used for premium diamond blade, wire saw and gang saw for hard stone cutting and drilling, mine and geological exploration.
Size: 25/30 ~ 70/80
Round Diamond / Thermal Conductive Diamond
Quasi-Spherical shape diamond, a higher specific surface area, easily to be incorporated. In the production of diamond thermal conductive composite materials, this spherical diamonds can be dispersed within the matrix, reducing diamond particles’ interspace and interfacial thermal resistance(ITR), thus improving diamond composite materials’ thermal conductivity.
Size: 30μm ~ 1000μm
Surface Corroded Diamond / Thermal Conductive Diamond
Roughening the surface of diamond by chemical methods, which can improve the retention between diamonds and bond systems when making sintered diamond tools.
Besides, the specific surface area was increased which can improve the interfacial contact area between the diamond and the metal substrate when it is used in thermal conductive diamond materials like Diamond-Cu, Diamond-Ti, Diamond-Cr, Diamond-W and Diamond-Al and other diamond composite materials. This facilitates heat transfer at the interface, reduces interfacial thermal resistance, thus improving the overall thermal conductivity of the diamond composite material.
Size: 2μm ~ 1500μm
